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3D-IC Packaging Working Group

  • Overview
  • Meeting Schedule
  • Presentations
  • Minutes
  • Projects


What's New in this Group?

As geometries continue to shrink and 2D scaling becomes increasingly difficult, 3D-IC packaging becomes a natural alternative. Many of 3D-IC packaging’s benefits, such as increasing complexity while simultaneously improving performance, reducing power consumption, and decreasing footprints are proven and readily understood.  As 3D-IC packaging becomes a commercially viable solution across many application domains, we can expect to see other benefits such as improving time-to-market, lowering risk, and lowering cost.


To be the acknowledged industry leader in 3D-IC packaging discussions, ecosystem development, and information dissemination, in order to accelerate the adoption and commercialization of 3D-IC packaging technology.


To provide a neutral, non-competitive forum for industry leaders to openly discuss widespread utilization of 3D-IC packaging technology; encouraging companies to represent their interests while helping to stimulate and shape the adoption of this technology.

  • Provide an avenue for idea exchange and discussion of the technical and commercial needs driving 3D-IC adoption; provide an educational forum.
  • Provide a forum for companies to present their accomplishments and solicit guidance for resolution to specific challenges, as well as discuss relevant and alternative solutions to 3D-IC packaging.
  • Provide industry guidance on emerging 3D-IC packaging fabrication, assembly, and test trends.
  • Understand and provide industry guidance for thermal, ESD, and test impact related to 3D-IC packaging adoption.

Contact Information

Kole Giles
Membership Manager
972.866.7579 x111

Working Group Chair
Ravi Gutala, SMTS, Altera

Meeting Schedule

What's New in this Group?

3D-IC Packaging

 Q1 2016 Meeting

Date: January 20, 2016
Time: 2 – 5 p.m.
Location: Zuken, Milpitas, CA

Overview and Registration

The Great Miniaturization: Systems and Packaging” November 10-11, 2015
Santa Clara, CA.; Presented by MEPTEC and SEMI
Device integration, and especially advanced packaging, drive electronic systems personal mobility – in your pocket, on your wrist, inside your body, in your home, in your car dashboard, almost everywhere. These systems must sense, collect and process data, communicate, and manage its use of power. As these electronics proliferate, highly-integrated electronic systems all the way to the cloud must accommodate this tsunami of data produced by mobile, wearable, and remote sensing. Packaging technologies, manufacturing solutions, as well as the business models that support production, must evolve to meet the challenges that this new era of mobile miniaturization will produce.

Q2 2016 Meeting

Date: April 20, 2016
Time: 2 – 5 p.m.
Location: San Jose; Host TBD

Q3 2016 Meeting

Date: July 20, 2016
Time: 2 – 5 p.m.
Location: San Jose; Host TBD

Q4 2016 Meeting

Date: October TBD, 2016
Time: 2- 5 p.m.
Location: San Jose; Host TBD


What's New in this Group?

January 20, 2015

October 21, 2015

July 15, 2015

April 14, 2015

January 21, 2015

October 22, 2014

July 23, 2014

April 9, 2014

January 22, 2014

October 16, 2013

July 17, 2013

April 17, 2013

 January 23, 2013

November 7, 2012

October 24, 2012

July 12, 2012

July 11, 2012

April 26, 2012

December 12, 2011

October 19, 2011


What's New in this Group?
2015 Meeting Minutes
2014 Meeting Minutes
2013 Meeting Minutes
2012 Meeting Minutes


What's New in this Group?

3D-IC Packaging brings many new and critical considerations into play.  The working group addressed some of these hurdles by deep exploration and analysis leading to guidelines / tools for the development community.

Our first effort, GSA-ESDA-3D-IC_ESD_Whitepaper, provides insight and guidance to Electrostatic Discharge (ESD) differences in stacked 3D-IC when compared to single die ESD design and assembly-test.

GSA  member companies, the ESD Association, and academia worked together to produce this whitepaper.  Your feedback is welcomed.

Interested parties may contact

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